Rod-shaped zinc oxide - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

May Ceramics Exhibition [Osaka] Exhibit Heat Dissipation Filler Rod-shaped Zinc Oxide

Actual display at the Ceramic Exhibition in Osaka: A high aspect ratio thermal filler that can be expected to improve thermal conductivity performance, such as TIM, by being added as a sub-filler.

We have released a new product for heat dissipation fillers, "Rounded Silicon Carbide," which combines high thermal conductivity and chemical stability, and excels in fillability and fluidity due to its rounded shape. ■Features - The high aspect ratio rounded rod shape makes it easy to form thermal conduction paths. - When combined with main fillers such as spherical alumina and aluminum nitride, a boosting effect on heat dissipation is expected. - The rounded edges derived from its crystal structure make it easy to fill into resins and other materials. Additionally, we will be exhibiting at the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held at Intex Osaka for three days starting from May 13, 2026 (Wednesday). We will also explain the features and expected applications of our new product "Rounded Silicon Carbide" for heat dissipation fillers, so please take this opportunity to visit our booth!